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Dry Etching of High Power VCSEL Array 

Certain applications in 3D sensing of VCSEL technology require higher power operation than Data Communication applications. As a result, there is a drive to produce high power VCSEL arrays of varying size and density depending on the combined output power required.

However, multiple challenges such as cost control and thermal crosstalk between VCSELs rise when producing high power arrays. In addition, challenges also occur in the process of fabrication of VCSELs. As the density of the arrays increase, better process control becomes critical to deliver performance and cost.

By combining strong process expertise and deep device understanding, Oxford Instruments Plasma Technology has developed advanced plasma processing solutions to enable current and future VCSEL designs.

In this White Paper you can learn:

  • How to control cost through process optimization at 150mm wafer size
  • How to improve process results for low emitter spacing in high power VCSEL
  • Impact of footing on your device performance
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