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Silicon Nitride

Silicon Nitride (SiNx) is widely used in the semiconductor industry. It's  applications include device passivation and etch masks. Si3N4 can be deposited using the following techniques:

Good uniformity and profile with low damage.

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Anisotropic and isotropic profile available at competitive etching rate with optimised uniformity.

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Competitive etching rate, selectivity and profile.

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High material quality and low damage, even at low deposition temperature.

  • Wafer size: up to 200mm
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Different chemistries can be used: pure and diluted silane
High quality films with low BOE
Excellent film thickness uniformity
Low hydrogen content with NH3 free process
Film stress control
Refractive index control
Low temperature deposition down to 20°C
Deposition rates from 5-100nm/min

  • Wafer size: up to 200mm
  • Batch size: up to 9x2" 4x3" 
  • Wafer size: up to 450mm  
  • Batch size: up to 61x2" 26x3" 15x100mm 9x120mm 7x150mm 3x200mm 
  • Product: PlasmaPro 1000
More on ICPCVD 了解更多信息

Different chemistries can be used: pure and diluted silane
High quality films with low BOE
Excellent film thickness uniformity
Low hydrogen content with NH3 free process
Film stress control
Refractive index control
Deposition rates from 5-500nm/min

More on PECVD 了解更多信息

Excellent stoichiometry with competitive deposition rate and controlled stress. 

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