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Platinum

Platinum (Pt) is a highly conductive metal that is commonly used in electrical contacts to devices. It can be etched using Inductively Coupled Plasma (ICP), Ion Beam Etching and Reactive Ion Etching (RIE). It may be deposited using Atomic Layer Deposition  (ALD) and Ion Beam Deposition (IBD).

Optimised etching rate with good selectivity to resist.

More on ICP 了解更多信息

Process achieves good etch rate available with photoresist mask.

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Pt etch with rotation and adjustable tilt. Process expertise applied to control redeposition and produce good profile at competitive etching rate. Competitive process results.

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Excellent quality, also possible at deposition .

  • Wafer size: up to 200mm
More on ALD 了解更多信息

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